| C-100 Series. | 厚膜电路、厚膜电子元件 Hibrid IC  Resistor Network
 | Ag 印刷性好、可焊性号、附着力强、低成本、符合RoHS要求 Ag High printability、High adhesion、Low cost、RoHS
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			| C-200 Series. | 厚膜电路、厚膜电子元件 Hibrid IC  Resistor NetworkThick film components
 | Ag/Pd印刷性好、抗焊料侵蚀性好、高可靠性、符合RoHS要求 Ag/Pd High printability、High solder leaching resistance、High reliability、RoHS
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			| C-300 Series. | 氮化铝基板用导体浆料 AlN Substrate
 | Ag 、Ag/ Pt无铅环保、附着力强、可焊性好、与AlN基片匹配性好 Ag 、Ag/ Pt lead-free  high adhesion  excellent solderability  excellent compatible with AlN substrates
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			| C-791 | 铜导体 Copper conductor.
 | Cu导体,氮气气氛700-800℃烧结,高电导率以及良好的细线分布、 N2 fireable at 700-800℃ ,high conductivity and excellent fine line resolution
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			| C-800 Series. | 厚膜电路、油位传感器 Thick film circuit, oil level sensor.
 | Ag/Pd,Ag/Pd/Pt无铅环保、细线分辨率高、耐磨性好、抗硫化性好、
				符合RoHS要求 Ag/Pd,Ag/Pd/Pt  Lead-free, high fine line resolution, good wear resistance, good chemical resistance.、RoHS
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			| C-211 Series | 柔性线路、触摸屏 FPC, Touch screens
 | Ag 无卤、印刷性好、柔性附着力好、适于激光雕刻 Ag  halogen-free, good printing, goodflexible adhesion,  suitable for laser engraving
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			| C-211B 
 | 片式元件可镀端头浆料 For chip component Terminal electrode, Platable
 
 | Ag无卤、印刷性好、涂敷性好,柔性附着力好、适于电镀 Ag halogen-free, good flexible adhesion, suitable for plating
 
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